Back-end Semi Con

A sudden spate of product ESD failures at a back-end IC packaging facility prompted a cause investigation.  The failures resulted in not only significant product loss resulting in scrappage of client products, but downstream losses due to supply chain interruptions.

Our active involvement in the investigation identified the cause to have originated from a wafer (dicing) saw.  Working closely with the Insured, our investigations identified a concurrent failure; exhaustion of the CO2 supply in addition to failure of the monitoring alarm system.

Whilst the product was damaged irreparably, prompt identification and resolution of the cause, coupled with adjustment to the production reschedules allowed for prompt recovery of the lost production, ensuring retention of the contracted business.